Samsung Semiconductor - K4B2G1646F-BYNB

KEY Part #: K7359666

[19090kpl varastossa]

Osa numero:: K4B2G1646F-BYNB

Valmistaja:: Samsung Semiconductor

Yksityiskohtainen kuvaus:: 2 Gb 128M x 16 2133 Mbps 1.35 V 0 ~ 85 °C 96FBGA Mass Production.

Valmistajan vakio läpimenoaika:: Varastossa

Kestoaika:: Yksi vuosi

Chip From:: Hongkong

RoHS:

Maksutapa:

Lähetyksen tapa:

Perheluokat:: KEY Components Co., LTD on elektronisten komponenttien jakelija, joka tarjoaa tuoteluokkia, mukaan lukien: LPDDR4, LPDDR5, LPDDR3, MODULE, GDDR5, HBM Aquabolt, HBM Flarebolt and GDDR6 ...

Kilpailuetu:: We specialize in Samsung Semiconductor K4B2G1646F-BYNB electronic components. K4B2G1646F-BYNB can be shipped within 24 hours after order. If you have any demands for K4B2G1646F-BYNB, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

GB-T-27922

ISO-9001-2015

ISO-13485

ISO-14001

ISO-28000-2007

ISO-45001-2018

K4B2G1646F-BYNB Tuoteominaisuudet

Osa numero : K4B2G1646F-BYNB

Valmistaja : Samsung Semiconductor

Kuvaus : 2 Gb 128M x 16 2133 Mbps 1.35 V 0 ~ 85 °C 96FBGA Mass Production

Sarja : DDR3

Tiheys : 2 Gb

Org. : 128M x 16

Nopeus : 2133 Mbps

Jännite : 1.35 V

Temp. : 0 ~ 85 °C

Paketti : 96FBGA

tuotteen tila : Mass Production

Uusimmat uutiset

Samsung Launches Industry’s First 12Gb LPDDR4 DRAM

Driving the Artificial Intelligence Evolution with In-Memory Computing

Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology

Evolving Mobile Solutions: Samsung at MWC 2018

Speed for the next generation of mobile devices

Samsung Electronics Takes 3D Memory to New Heights with Sixth-generation V-NAND SSDs for Client Computing

High Bandwidth Memory is Catching on for Data-intensive Computing

Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM

Samsung Electronics Starts Mass Producing Industry’s First 8-Gigabit Graphics DRAM (GDDR5)

5G and Memory - from Connected Thinking to Connected Living

NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters

[Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions

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