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HEATSINK STAMP 10X21.2X19MM.

HEAT SINK 37.5 X 37.5 X 7.5MM. Heat Sinks maxiFLOW BGA Heatsink, Thermal Tape, Blue-Anodized, T412, 37.5x37.5x7.5mm

MAXIGRIP FANSINK 31X31X9.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 30.25x30.25x9.5mm, 30.25mm dia.

HEATSINK TO-220 17.78X44.45MM.

HEATSINK BGA W/ADHESIVE TAPE. Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 27x27x10mm, IC Pkg Size = 27 x 27, Tape #35

HEAT SINK 45MM X 45MM X 17.5MM. Heat Sinks maxiFLOW Heatsink with maxiGRIP Attachment, Double-Sided Thermal Tape, Blue-Anodized, T412, 45x45x17.5mm

HEATSINK TI TAS5622 AND TAS5624. Heat Sinks Heatsink for TI Module TAS5622/TAS5624, Black-Anodized, 78x36x35.6mm

HEAT SINK BLK ANOD ALUM TO-220.

HEATSINK 25X25X10MM L-TAB CP.

HEATSINK 30X30X15MM R-TAB CP.

HEATSINK ALUM ANOD.

HEATSINK ALUM ANOD.

HEAT SINK EXTRUSION TO-220 25. Heat Sinks 25.4x32x20mm w/pin extrusion TO-220

HEATSINK ALUM ANOD.

HEAT SINK 19MM X 19MM X 9.5MM. Heat Sinks BGA Heatsink, High Performance Extrusion, Square Fins, Double-Sided Thermal Tape, Black-Anodized, 19x19x9.5mm

HEATSINK ALUM ANOD.

HEAT SINK 19MM X 19MM X 9.5MM. Heat Sinks BGA Heatsink, High Performance X-CUT, Square Fins, Double-Sided Thermal Tape, Black-Anodized, 19x19x9.5mm

HEAT SINK 31MM X 31MM X 17.5MM. Heat Sinks maxiFLOW BGA Heatsink, Thermal Tape, Blue-Anodized, T412, 31x31x17.5mm

MAXIGRIP FANSINK 27X27X9.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 26.25x26.25x9.5mm, 26.25mm dia.

HEATSINK TO-247 TO-264 TO-220.